PCB Copper thickness Price chart
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6
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88
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September 2, 2024
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LIVE Q&A: Stack-Up Design
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21
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673
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July 16, 2024
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Ask Me Anything about IPC Class 3
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20
|
119
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July 31, 2024
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Ask Me Anything about Thermal Management
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10
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221
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June 19, 2024
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Stack-Up Configurations for 2-layer and 4-layer PCBs
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7
|
103
|
August 5, 2024
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Smart Prepreg Selections
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2
|
33
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October 11, 2024
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Via size and why should I pick one over another
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4
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81
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October 8, 2024
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Thermal effects of component placement on different PCB layers
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4
|
76
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August 26, 2024
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Ask Me Anything with Karen Burnham
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17
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504
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May 22, 2024
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Win a seat for Karen Burnham's seminar on antennas and EMI!
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11
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253
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July 9, 2024
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Choosing the Right Decoupling Capacitor for Lower Frequency Transients
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8
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212
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August 26, 2024
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Is it acceptable for PCB traces to cross on different layers?
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9
|
138
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August 22, 2024
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5 Best Design for Assembly Tips for Error-Free PCBAs
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0
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43
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November 4, 2024
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Signal Return Paths in a multilayer PCB Stack-Up
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8
|
277
|
July 18, 2024
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Optimal Placement of Stitching Vias
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14
|
549
|
July 25, 2024
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Best Practices for Handling High Currents on PCBs
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15
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226
|
November 6, 2024
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QFN Pre-Baking Necessity
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6
|
192
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June 27, 2024
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Disconnecting QFN Pad from Ground
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11
|
269
|
June 11, 2024
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Choosing the right PCB Material
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6
|
178
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August 19, 2024
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Copper thickness and power loss
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2
|
38
|
September 17, 2024
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Ground Pours considerations
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5
|
341
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April 11, 2024
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Ask Me Anything about High-Voltage PCBs
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8
|
110
|
August 7, 2024
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Via placement instead of plated mounting hole
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2
|
31
|
October 4, 2024
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Understanding Prepreg and Core
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17
|
356
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September 9, 2024
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Optimizing VIA Drill Pairs for Multilayer PCB
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10
|
265
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April 12, 2024
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Ask Me Anything with PCB West speaker Syed Ubaid Ali Warsi (high speed and EMC)
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13
|
579
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March 23, 2024
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KiCAD for serious hardware development
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31
|
266
|
December 1, 2023
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Solder mask expansion requirement!
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10
|
243
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October 7, 2024
|
Ask Me Anything with Xinran Li (DDR5)
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|
18
|
544
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April 17, 2024
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Optimal Grounding Strategies for High-Speed Signals in Two-Layer PCBs
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3
|
66
|
July 25, 2024
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