Choosing the right PCB Material
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6
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175
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August 19, 2024
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Optimizing VIA Drill Pairs for Multilayer PCB
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10
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251
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April 12, 2024
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Optimal Placement of Stitching Vias
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14
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459
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July 25, 2024
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Ask Me Anything with PCB West speaker Syed Ubaid Ali Warsi (high speed and EMC)
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13
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577
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March 23, 2024
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Routing a signal trace over a split reference plane
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6
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398
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May 2, 2024
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Ask Me Anything with Xinran Li (DDR5)
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18
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526
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April 17, 2024
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Voids between substrate layers
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5
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241
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June 13, 2024
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Ask Me Anything with Kirsch Mackey (AI and PCB design)
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23
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577
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April 8, 2024
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Voltage drop on ground - long cable
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3
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19
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July 18, 2024
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KiCAD for serious hardware development
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31
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260
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December 1, 2023
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Ground and Power Plane Considerations
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7
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349
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May 2, 2024
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Ground Pouring Strategy for 4-Layer PCB Design
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6
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161
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June 24, 2024
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De-coupling capacitors
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5
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85
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July 24, 2024
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Optimizing Ground and Power Pours in Two-Layer PCB Designs
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3
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58
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July 17, 2024
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Designing Built-in Capacitors on a PCB
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7
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280
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August 1, 2024
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Optimizing Power and Ground Planes in a 4-Layer PCB Design
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5
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265
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March 29, 2024
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Zero-Gap PCB Stacking with Electrical Connectivity
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2
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35
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July 29, 2024
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Ask Me Anything with Amit Bahl (DFM)
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17
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975
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February 22, 2024
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BGA sizes issues
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9
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344
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June 19, 2024
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Ask Me Anything about RF
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11
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364
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May 29, 2024
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Bogatin’s Practical Guide to Transmission Line Design and Characterization for Signal Integrity Applications
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22
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515
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January 16, 2024
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Impedance Matching and Power Consumption in Digital Interfaces
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7
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234
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June 28, 2024
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Optimal Distribution of Vcc in a 4-Layer PCB Design
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5
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382
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April 19, 2024
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Ask Me Anything about Component Selection
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3
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356
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June 17, 2024
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Best Stack-up selection for a High-Density Board Design
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3
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170
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May 30, 2024
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Impact of Panelization on PCB Design
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2
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102
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June 25, 2024
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Ask Me Anything with Susy Webb
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27
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465
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October 10, 2023
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Optimizing Ground Plane for RF Tuner Breakout
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4
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185
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April 15, 2024
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Pin Assignment for BGA Packages in FPGA Designs
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4
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256
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May 21, 2024
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Samtec Signal Integrity Handbook
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5
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363
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January 18, 2024
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