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Solder mask expansion requirement!
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10
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257
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October 7, 2024
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Choosing the right PCB Material
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6
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181
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August 19, 2024
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Smart Prepreg Selections
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2
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36
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October 11, 2024
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Ask Me Anything about High-Voltage PCBs
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8
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110
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August 7, 2024
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KiCAD for serious hardware development
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31
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280
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December 1, 2023
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Ask Me Anything with PCB West speaker Syed Ubaid Ali Warsi (high speed and EMC)
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13
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579
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March 23, 2024
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Microwave PCB Design Challenges and How to Overcome Them
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4
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27
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November 27, 2024
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Optimizing VIA Drill Pairs for Multilayer PCB
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10
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275
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April 12, 2024
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Copper thickness and power loss
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2
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38
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September 17, 2024
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Ask Me Anything with Xinran Li (DDR5)
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18
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551
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April 17, 2024
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Routing a signal trace over a split reference plane
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6
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457
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May 2, 2024
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Ask Me Anything with Kirsch Mackey (AI and PCB design)
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23
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578
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April 8, 2024
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Bogatin’s Practical Guide to Transmission Line Design and Characterization for Signal Integrity Applications
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22
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576
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January 16, 2024
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Ground and Power Plane Considerations
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7
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449
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May 2, 2024
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Designing Built-in Capacitors on a PCB
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7
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320
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August 1, 2024
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Ask Me Anything with Amit Bahl (DFM)
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17
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978
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February 22, 2024
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Optimal Grounding Strategies for High-Speed Signals in Two-Layer PCBs
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3
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70
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July 25, 2024
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Voids between substrate layers
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5
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247
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June 13, 2024
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Via placement instead of plated mounting hole
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2
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36
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October 4, 2024
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Referencing signal to VCC or GND planes
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6
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193
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August 29, 2024
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Optimizing Power and Ground Planes in a 4-Layer PCB Design
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5
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285
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March 29, 2024
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Top 5 DFA Rules for an Efficient Aerospace PCB
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2
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74
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December 2, 2024
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Ask Me Anything with Susy Webb
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27
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471
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October 10, 2023
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Impedance Matching and Power Consumption in Digital Interfaces
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7
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249
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June 28, 2024
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5 Best Design for Assembly Tips for Error-Free PCBAs
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0
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48
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November 4, 2024
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Ground Pouring Strategy for 4-Layer PCB Design
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6
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200
|
June 24, 2024
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Samtec Signal Integrity Handbook
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5
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369
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January 18, 2024
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Optimal Distribution of Vcc in a 4-Layer PCB Design
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5
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389
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April 19, 2024
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Manufacturing Capabilities
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5
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27
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September 4, 2024
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BGA sizes issues
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9
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354
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June 19, 2024
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