Events   Ask Me Anything

bga ,  bga-breakout ,  bga-fanout

cost

stackup ,  stack-up

via ,  drilling

emc

controlled-impedance ,  impedance

assembly ,  pcb-assembly ,  dfa

current-capacity ,  current

supply-chain

kicad

high-speed ,  ask-me-anything ,  ama

hdi ,  via ,  blind-via ,  buried-via

voltage

ipc ,  ipc-class-3

routing ,  pcb-routing

emc ,  emi

ipc-2581 ,  pcb-files ,  gerber ,  odb

design ,  pcb-design ,  design-constraints ,  constraints

thermal-management ,  ask-me-anything ,  ama

components ,  ask-me-anything ,  ama ,  component-selection

power-integrity ,  power

rf

emi ,  emc

signal-integrity ,  ask-me-anything

pcb-materials ,  rf ,  materials

ddr5 ,  ddr

thermal-management ,  heat-management

ai ,  artificial-intellige