|
Welcome to SierraConnect! :wave:
|
|
61
|
1313
|
January 2, 2024
|
|
Trace width for aerospace PCBs
|
|
7
|
36
|
March 23, 2026
|
|
Impedance control for low-speed analog traces
|
|
6
|
38
|
March 19, 2026
|
|
IPC-6012 or IPC-A-600: Which Standard Should You Use?
|
|
1
|
3
|
March 18, 2026
|
|
How do you design reliable microvias?
|
|
2
|
5
|
March 18, 2026
|
|
Webinar: What Your CM Wishes You Knew About Design for Assembly
|
|
1
|
294
|
March 17, 2026
|
|
Why Do PCBs Cost Less in China Than in the USA?
|
|
0
|
1
|
March 17, 2026
|
|
Why consumer power adapters & small appliances often use single-sided PCBs
|
|
5
|
24
|
March 17, 2026
|
|
Webinar: Stop Making These Medtech PCB Design Mistakes
|
|
0
|
68
|
March 13, 2026
|
|
DDR4 layer assignment
|
|
18
|
136
|
March 13, 2026
|
|
How do you avoid assembly errors in your layout?
|
|
2
|
19
|
March 11, 2026
|
|
PCB Failures. Cracked Vias and Layer Separation
|
|
4
|
24
|
March 10, 2026
|
|
6 Decap Placement Rules for PCB Designer
|
|
0
|
47
|
March 10, 2026
|
|
Making Sense of Wave Soldering
|
|
0
|
7
|
March 6, 2026
|
|
Via-in-pad
|
|
0
|
53
|
March 5, 2026
|
|
How to Use Via-in-Pad for PCB Design and Manufacturing
|
|
0
|
5
|
March 4, 2026
|
|
How do you avoid common DFM issues before sending files to fab?
|
|
2
|
25
|
March 4, 2026
|
|
How do you manage thermal issues in your PCB designs?
|
|
2
|
77
|
February 25, 2026
|
|
PCB Procurement Checklist for Hardware Engineers
|
|
0
|
14
|
February 24, 2026
|
|
When do you choose an HDI PCB stack-up over a standard one?
|
|
2
|
20
|
February 18, 2026
|
|
How manufacturers define minimum annular ring size for vias
|
|
7
|
78
|
February 13, 2026
|
|
How and when do you decide to use via filling in your PCB designs?
|
|
2
|
115
|
February 11, 2026
|
|
Common Soldering Defects in PCBs and How to Avoid Them
|
|
0
|
47
|
February 10, 2026
|
|
PCB Glossary: IPC Class 3
|
|
0
|
64
|
February 5, 2026
|
|
How do you decide the trace width for your PCB designs?
|
|
2
|
124
|
February 4, 2026
|
|
How to bring onboard LED indicators to an enclosure exterior
|
|
5
|
44
|
February 3, 2026
|
|
Webinar: When PCB Design Speed Catches Up to Manufacturing
|
|
0
|
230
|
February 2, 2026
|
|
How to quantify copper balance between PCB Layers
|
|
4
|
44
|
January 30, 2026
|
|
Ball Grid Array (BGA): Features, Soldering Technique, and X-Ray Inspection
|
|
0
|
14
|
January 30, 2026
|
|
What is Signal Propagation Delay in PCBs?
|
|
0
|
9
|
January 30, 2026
|