Today's Discussion
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About the Today's Discussion category
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0 | 7 | July 17, 2026 |
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How do wave-solderable smd packages survive direct wave contact
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2 | 16 | August 6, 2026 |
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What's your approach to BGA fanout before routing the rest of the board?
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2 | 9 | August 5, 2026 |
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POLL: At what trace/space do you involve your fabricator?
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0 | 6 | August 3, 2026 |
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Can return path discontinuities cause conducted emissions on a 4-Layer PCB?
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4 | 29 | July 31, 2026 |
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How do you decide when via stubs need to be removed?
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2 | 21 | July 29, 2026 |
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POLL: How early do you think about DFA?
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0 | 13 | July 27, 2026 |
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SELV vs FELV Isolation Requirements
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3 | 30 | July 24, 2026 |
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Designing PCBs for space: What should you know about IPC Class 3?
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0 | 15 | July 22, 2026 |
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How do you keep power supply noise away from sensitive circuits?
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2 | 16 | July 22, 2026 |
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What would make you participate more often?
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4 | 36 | July 21, 2026 |