PCB manufacturing has a lot of rules, tolerances, and processes that designers are expected to understand but they’re not always explained very well.
Soooo dear designers: what’s one manufacturing topic you wish Sierra explained more clearly?
Maybe it’s:
- How your stack-up is actually built
- What “minimum” trace/space really means
- Via aspect ratios and annular rings
- Controlled impedance
- Why your fab flags certain things during DFM
Or something completely different??