HDI designs provide greater routing density and flexibility, but choices such as layer count, sequential laminations, via structures, drilling methods, and trace/space can directly affect manufacturing complexity and cost.
I wanted to start a discussion on how designers balance these factors early in the design process.
Stack-up complexity is an important factor in HDI cost and manufacturability:
Lamination cycles: Moving from 1-N-1 to 2-N-2 or 3-N-3 adds sequential lamination steps, increasing process time and cost. Furthermore, it may also increase the risk of registration.
Material selection: More complex builds place additional demands on the material. For example, a 3-N-3 structure can involve four lamination cycles before assembly, making material robustness an important consideration. Materials must be chosen not just for Dk/Df, but for thermal robustness (Tg, Td, and z-axis CTE).
Eliminating unnecessary drills: Some designs may not need a final mechanical drill if the required connections can be achieved using laser drills and buried mechanical vias. This can eliminate an additional drill cycle and registration step.
The choice between stacked and staggered microvias can also affect process complexity:
Stacked microvias: Filling or plating microvias from the bottom-up to support the next layer’s landing pad adds time and cost. Stacking on top of buried mechanical vias is also known to create thermal stress concentration points and micro-cracking risks.
Staggered microvias: Staggering can eliminate the need to fill the first laser-drilled microvia because the second drill does not land directly on it. The required spacing between the laser drills still needs to meet the manufacturer’s capabilities.
Via-in-pad: Via-in-pad can require additional drilling, plating, and filling steps. Where the design permits, offset laser-drilled microvias can provide an alternative with fewer process steps.