Ask Me Anything about High-Voltage PCBs

Events Ask Me Anything
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Join our Ask Me Anything about high voltage where you can ask us questions on:

  • Materials for insulation and reliability
  • Calculating trace and space
  • Heat dissipation
  • And much more!

:speech_balloon: Question submission window: Through August 7th

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What are the clearance and creepage distances you recommend for high voltage circuits?

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What materials function best for high voltage?

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How do I ensure proper isolation between high voltage and low voltage sections?

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How do you handle thermal dissipation in high-voltage circuits, including component placement, heat sink selection, design considerations, material choice, and active cooling methods?

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To determine clearance and creepage distances for high-voltage circuits, refer to IPC-2221C Table 6-1. This provides a comprehensive clearance guideline based on voltage between two conductors and elevation. Our blog, “Applying IPC-2221 Standards in Circuit Board Design,” explains these standards and includes the IPC-2221 Table 6-1 information in Table 1 and Table 2 for easy reference.

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Polyimide and Teflon are the preferred materials for high-voltage PCBs. They both provide excellent electrical insulation and high thermal stability. Polyimide offers superior mechanical strength and flexibility, making it suitable for complex circuits. Teflon is known for its low dielectric constant and high chemical resistance, which ensures minimal signal loss and durability in harsh environments.

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Maintain sufficient separation between high-voltage and low-voltage sections in PCBs to ensure proper isolation. Adhere to recommended clearance and creepage distances as per IPC-2221C. Adequate spacing prevents electrical arcing and ensures safety and reliability in your PCB designs.

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Effective thermal dissipation in high-voltage circuits requires careful planning from the start of the design phase. You must consider heat sinks, heat exchangers, active cooling, and airflow management right from the beginning. The final approach will be influenced by the board’s packaging and the specific thermal needs of the application.