| Welcome to SierraConnect! :wave: |           | 61 | 811 | January 2, 2024 | 
        
          | Do Fabricators Need Drill Maps on Fab Drawings? |     | 1 | 2 | October 30, 2025 | 
        
          | Webinar: Via-in-Pad and Microvia Design Techniques for HDI Boards |   | 0 | 217 | October 28, 2025 | 
        
          | Should vias be tented on one side or both? |           | 9 | 61 | October 28, 2025 | 
        
          | What Causes High-Leakage Current in PCBs and How to Prevent It? |   | 0 | 2 | October 28, 2025 | 
        
          | Ground Plane Strategy for a 2-Layer PCB from an EMI/EMC Perspective |           | 5 | 24 | October 20, 2025 | 
        
          | PCB Cost Breakdown |   | 0 | 32 | October 16, 2025 | 
        
          | Best practices for using ground pours on 4-layer PCBs with internal planes |         | 3 | 37 | October 10, 2025 | 
        
          | Why Choose Halogen-Free PCBs for Sustainable Electronics |   | 0 | 10 | October 9, 2025 | 
        
          | How can I extract XY (Pick & Place) coordinates from an old Gerber file for assembly? |     | 1 | 26 | October 8, 2025 | 
        
          | Ask Us Anything about... PCBs |   | 0 | 33 | October 7, 2025 | 
        
          | Design Considerations and Simulation for RF Components |   | 1 | 738 | October 7, 2025 | 
        
          | Best practices for grounding USB/high-speed cable shields |           | 4 | 116 | October 7, 2025 | 
        
          | Best Practices for Tying Digital, Analog, and Chassis Grounds in Mixed-Signal PCBs |           | 7 | 71 | October 6, 2025 | 
        
          | PCB Glossary: Via Stub |   | 0 | 54 | October 3, 2025 | 
        
          | PCB for 230 VAC @ 8 A — Please Check My Understanding |     | 1 | 34 | September 29, 2025 | 
        
          | How to Reduce Ground Bounce in PCB Assembly |   | 0 | 23 | September 29, 2025 | 
        
          | PCB designer is asking for some of the math behind "the signal is in the field" |         | 7 | 134 | September 26, 2025 | 
        
          | TPS1685: TPS16850VMAR << a few pins connection wasn't sure |     | 2 | 25 | September 25, 2025 | 
        
          | Rogowski Coil |     | 2 | 56 | September 25, 2025 | 
        
          | RF Series 4/4: RF PCB Thermal Management and Simulation |   | 0 | 359 | September 24, 2025 | 
        
          | Seminar: Shielding Systems for EMI by Karen Burnham |   | 0 | 19 | September 22, 2025 | 
        
          | Seminar: Designing the Routing and Signal Energy Path in Digital PCBs by Susy Webb |   | 0 | 14 | September 22, 2025 | 
        
          | Hatched vs. Solid Copper Pour |           | 15 | 119 | September 19, 2025 | 
        
          | Webinar: A Perfect Design Ends with DFA |   | 0 | 208 | September 18, 2025 | 
        
          | Best practices for maintaining return current continuity when routing high-speed signals between two reference planes |           | 11 | 85 | September 18, 2025 | 
        
          | How to Choose PCB Laminates Based on IPC Standards |   | 0 | 20 | September 18, 2025 | 
        
          | Key Aspects of DFM for HDI PCBs |   | 0 | 22 | September 16, 2025 | 
        
          | Mcad/ecad collaboration, handshake |     | 5 | 28 | September 12, 2025 | 
        
          | Designing and Fabricating Ultra-HDI PCBs |   | 0 | 24 | September 10, 2025 |