Originally published at: https://www.protoexpress.com/blog/how-to-design-pcbs-for-data-centers-and-ai-servers/
Designing PCBs for AI servers and hyperscale data center platforms requires architectures that support extreme routing density, high-speed serializer/deserializer (SerDes) signaling, and low impedance power delivery. Layout engineers and signal integrity experts must adopt HDI for fine-pitch BGAs and select materials that meet the loss budgets of 112G and emerging 224G PAM4 signaling for high-performance computing systems. In this article, you’ll learn printed board types used in hyperscale facilities, how to pick materials for 112G/224G signaling, and stack-up and layout techniques for long-term reliability. Highlights: Use HDI in data center PCBs when BGA pitch ≤0.5 mm or the routing density…