Originally published at: https://www.protoexpress.com/blog/case-study-designing-hdi-board-with-4-and-65-mm-bgas/
BGA technology makes it possible to achieve a smaller form factor in PCBs. With a higher pin count, excellent thermal compatibility, and improved current distribution, they are well-adapted to microprocessors, microcontrollers, RAM devices, and display boards. The smaller the pitch of a BGA, the more challenging it is to break out and route the pins. Some of the challenges that we faced while designing this HDI board with 0.4 and 0.65 mm BGAs are explained in this case study. We will go over the requirements, the key design limitations, and the methods we used to make the board successful. Highlights:…