For a 14A current path, is it acceptable to route through vias, or is it better to split the current across wider traces on multiple layers (for example, 120 mil on top and 120 mil on bottom)?
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I have done parallel copper layers in projects in order to minimize current path width limitations. This can also improve thermal dissapation.
Vias can also be done however you need to make sure the vias can support the current. Paralleled vias may not equally split current so you should be sure to add a derating value when deciding the number of vias to be used.
As far as which is better - that likely depends on specific project limitations that you are required to design within. In any case, be sure to add a much copper as practical to keep the assembly as cool as possible.
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Vias do add resistance, so their current-carrying capability depends on their size and quantity. Another important factor is the current path, whether the current stays on one layer or has to transition between layers (for example, source on top and load on bottom). If the current has to pass through vias, they become part of the current bottleneck, so they need to be sized and distributed accordingly.
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Current won’t split evenly between parallel paths. In practice, some imbalance always exists due to small resistance differences, whether from trace geometry, via plating variation, or layout asymmetry.
A common approach is to apply a derating factor when sizing parallel conductors. Adding 20-30% margin helps ensure no single path is overloaded. This principle applies equally to multiple traces across layers and parallel via arrays.
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