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| Question | Answer |
|---|---|
| Do you need to include the IPC-D-356 if you are using ODB++ or IPC-2581? | You typically do not need to include a separate IPC-D-356 netlist when using ODB++ or IPC-2581 formats, as the netlist information is already embedded within these file formats. |
| IPC 2222 is for PCB Cross Section | The standard mentions the optimized rules for efficient component placement, routing density, and superior electrical performance to achieve a flawless design. Used in conjunction with IPC-2221, IPC-2222 sets standards for the following factors to increase the manufacturability of a rigid circuit: 1. Holes and interconnections specifics 2. Dielectric spacing 3. Selection of materials 4. Routing parameters 5. Board thickness tolerance 6. Mechanical parameters |
| Does sierra stock their preferred components? | Sierra offers a Customer-Owned Inventory (COIN) program and stocks a range of commonly used components. However, availability depends on the specific components you need. If you share the details, we can check and get back to you with accurate information. |
| Do we need to register to use these tools? | Some tools can be used without registration, while others require you to log in before accessing them. |
| Does IPC 6012 F specify that copper thickness is preferred in Microns? | IPC-6012F does allow copper thickness to be specified in microns, and this is often considered a preferred unit in the standard. However, in industry practice, copper thickness is still widely expressed in ounces per square foot. As a reference, 1 ounce of copper is approximately equal to 35 microns. |
| I need a project done by Sierra. Who should I contact? | Send an email to: lucyi@protoexpress.com |
| Does Sierra have a downloadable example project that includes these standards rules for us to be able to start from? (Altium or allegro) | You can refer to our IPC design guide for guidance on these standards. We are also working on providing downloadable example projects for tools like Altium and Allegro. |
| What are your typical lead times for board fab and board assembly? | Lead times depend on the complexity of your project. For standard rigid FR-4 boards, fabrication typically takes around 3 to 5 days. If your design includes advanced features such as sequential lamination, blind/buried vias, or microvias, the fabrication time will be longer. For assembly, you can expect to add approximately 5 additional days. Overall, the total turnaround time varies based on the design complexity and specific requirements. |
| Are assembly and fabrication drawings preferred when sending over a fabrication package? What standards should be referenced, or design/fab guidelines, should be included in these drawings if needed? | Yes, we prefer that both fabrication and assembly drawings be included in the PCB package. Even if you provide complete data in formats like IPC-2581, the fabrication drawing should clearly define how the board is to be built, including materials, stack-up, finishes, and special requirements. Similarly, the assembly drawing should provide clear instructions for component placement, orientation, and any specific assembly notes to ensure accurate population of the board. |
| Which IPC standard is used for a rigid-flex PCB? | For rigid-flex PCBs, the commonly used IPC standards are IPC-2223 and IPC-6013. IPC-2223 provides design guidelines for flexible and rigid-flex circuits, while IPC-6013 defines the qualification and performance requirements for flexible and rigid-flex printed boards. |
| Why was IPC-7351 not revised instead of creating IPC-7352? | IPC-7351 was not revised because surface-mount (SMT) and through-hole (THT) components have fundamentally different requirements. IPC-7351 focuses on defining land patterns (footprints) for surface-mount components, while IPC-7352 was created separately to address land patterns for through-hole components. This separation ensures clearer guidelines tailored to each technology. |
| How we can define the edge board plating? | Edge board plating can be defined based on the specific application and requirements. For edge connectors (commonly known as gold fingers), hard gold plating is typically used. This involves nickel plating over copper, followed by a layer of hard gold to ensure durability and good electrical contact. If you are referring to plating along the board edges (peripheral edge plating), this can be applied selectively to specific areas or across the entire board perimeter, depending on your design needs. However, it is important to leave some unplated areas or tooling rails to allow proper handling of the PCB during manufacturing. |
| For high-current designs, does the advanced trace width consider planes stitches in multiple internal layers? | No, our advanced trace width calculator does not take plane via stitching into account for heat transfer. However, it does consider the effect of adjacent copper planes, based on the reference graphs provided in the relevant IPC standards. |
| Do you have technology to embed aluminum or copper bars in the PCB for heatsinking? | Yes, we support both internal and external copper or aluminum layers for heatsinking. However, these are implemented as full layers within the PCB stack-up, not as isolated bars or embedded coins. |
| For assembly, what are the lead time and cost variations between designs with many through-hole components vs. solely using surface mount components? | Designs with a large number of through-hole components typically result in longer assembly lead times and higher labor costs, as they often require manual or selective soldering processes. They can also be less scalable for high-volume production. In contrast, fully surface-mount (SMT) designs generally enable faster production, lower costs at scale, and improved manufacturability due to their compatibility with automated assembly processes. |
| What is the limiting factor for internal trace temperature rises? | The temperature rise of internal traces is influenced by several factors, including dielectric thermal conductivity, copper thickness, and overall board construction. According to IPC-2152, when comparing internal and external traces with similar configurations, the temperature rise is nearly the same, as shown in the standard’s reference plots. |
| Does Sierra support 2581C? | Yes, Sierra supports IPC-2581C. |
| Do you have specific requirements or recommendations on the use of KiCad for PCB design and documentation? | Documentation is standardized. We do not have specific requirements for using KiCad in PCB design. |