Originally published at: https://www.protoexpress.com/blog/via-filling-techniques-designers-need-to-know-for-pcb-fabrication/
Via filling is a technique in which the plated hole is completely filled with a conductive or non-conductive material. It enhances the reliability of the PCB by reducing the possibility of air or liquid getting trapped. In this article, you will learn the benefits, types, manufacturing process, and failure analysis of via filling. What is the purpose of via filling? A via is a copper-plated hole that creates an electric connection between different layers of a PCB. Normally, any type of via such as through-hole, microvia, blind, and buried can be filled. First, the hole wall is plated to make…