Very few manufacturers have this via fill machine

Introducing our cutting-edge via filling machine, a technological marvel designed to elevate the precision and reliability of PCB manufacturing. This innovative system employs a vacuum-assisted resin-filling process, ensuring meticulous and void-free via filling. The machine utilizes a powerful vacuum mechanism to squeeze the resin, effectively removing any trapped air bubbles.

This technique not only enhances the quality of filled vias but also contributes to the overall integrity and performance of the printed circuit boards. With a focus on precision and efficiency, our via filling machine represents a significant advancement in the field of PCB fabrication, promising superior results for the most demanding applications.

This machine basically uses a vacuum that squeezes the resin and removes air bubbles for precision filling.

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