High-Speed PCB Via Design and Manufacturing

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After several attempts to register for the “High-Speed PCB Via Design and Manufacturing” webinar, no confirmation has still been received.
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What do I need to do.

Since I never received an email confirmation after subscribing to the webinar, can you please provide me with the contact of the webinar organizer, or at least, the contact of the webmaster.
Thanks in advance.

------ Message d’origine ------
De “Jeffrey via SierraConnect” <notifications@sierraconnect.discoursemail.com>
À py.ohayo@sunrise.ch
Date 21.02.2024 16:19:11
Objet [SierraConnect] [Events] High-Speed PCB Via Design and Manufacturing

Hi Jeffrey, I see that you’re registered and that you’ve received the confirmation email. You’re good to go.

Hi, I see that your email is marked as hard bounce in our database. I’ll send you the confirmation email manually. Thanks for reaching out here.

I am the J in the picture you pasted. This is the email I received.

“hard bounce” … what does it mean ?

I don’t remember contacting you before.

------ Message d’origine ------
De “Lucy Iantosca via SierraConnect” <notifications@sierraconnect.discoursemail.com>
À py.ohayo@sunrise.ch
Date 21.02.2024 18:30:49
Objet [SierraConnect] [Events] High-Speed PCB Via Design and Manufacturing

I’m not sure, it can be for various reasons. I’ll send a calendar invite to all the registrants today.

If you are not the right person I was looking for, I apologize for bothering you.
Certainly webmaster of this site has work to do.

------ Message d’origine ------
De “Jeffrey via SierraConnect” <notifications@sierraconnect.discoursemail.com>
À py.ohayo@sunrise.ch
Date 21.02.2024 18:34:11
Objet [SierraConnect] [Events] High-Speed PCB Via Design and Manufacturing

Watch under that Email, a RED BOTTOM square that says “JOIN WEBINAR” – if you do not see it, then you had the wrong confirmation and later was upgraded. In That case, you will need a link from Lucy

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Hello, I am having trouble joining the webinar. Is it available as a recorded video?


And you can join here:
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Passcode: 099296

Thank you! I was able to join. It was very interesting and informative!

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Does via-in-pad allow for BGA pads in class 3 designs?

Yes, you can incorporate via-in-pads to break out BGAs in class 3 designs. However, it’s crucial to ensure the pad size is sufficiently large to accommodate both the via and the minimum annular ring diameter as per IPC class 3 standards. Also, opt for filled vias to mitigate potential assembly issues such as joint voiding, cold solder, and uneven planar surfaces on SMT pads…

Is the calculator limited by the number of reference planes?

Sierra Circuits’ Via Impedance Calculator has through-hole, blind, and buried via models with single and two reference planes.

Does rise time of the signal changes the impedance of the via?

No, via impedance is independent of signal rise time. It depends on their physical characteristics, such as dielectric constant, hole, pad and antipad diameter.

I am curious: why not use a blind via instead of the back drill?

Blind vias may fail to establish the desired layer-to-layer connections as per your design specifications. Additionally, employing blind vias can lead to higher manufacturing costs compared to back drilling, as it necessitates more lamination cycles.

Do you have a preferred way for the PCB designer to specify backfilled vias? Can it be noted in the ODB/Gerber?

You can specify your back drilling specs, in your fab notes and drill drawing. You can also provide the information under particular layers in the stack-up files.

1.What frequencies are we talking about for stub resonance?
2. Skin depth effects: Can separate currents be flowing on the inside and outside of the via?

  1. The stub resonance frequency depends on the signal speed through the via, dielectric constant, propagation delay, and via length.
  2. Separate currents wouldn’t flow inside and outside of a via due to the skin effect. Skin effect is the same for both vias and horizontal conductors. Here’s the explanation:
    AC current flows through a via and experiences the skin effect. The current density will be highest at the outer surface and decrease towards the center of the via barrel. But, the skin effect doesn’t create two separate currents: inside and outside. The current flows continuously throughout the via barrel, but with a higher concentration near the surface.