PCB Manufacturing Inquiry – 0.15 mm Microvias, Buried Vias and Mech through-hole Vias

Design and Layout Design for Manufacturing
1

I would like to ask about Sierra manufacturing capability for a 10-layer PCB with 0.15 mm microvias, buried vias and through-hole PTHs.

I want to design a PCB that is 1.6 mm thick and has a BGA requiring fan-out. The via structure is:

UVia: L1–2, L2–3, L8–9, L9–10

Buried mechanical vias: L3–8

Through-hole mechanical PTH: L1–10

Is it ok for the mech buried vias and PTH with 0.15mm? Can the buried vias stacked with uvia?

Thank you!

1 Like
2

Hello, our R&D manager will look at this and reply here. In the meantime, I can tell you that yes we can make a sub via of that size. We should not stack on the buried for reliability reason. Staggered is always better.

3

This is a common build for us so yes to all of it.

1 Like
4

@jjiang let me know if you have more questions or want me to connect you with an account manager/engineering team.

5

Thanks for all of your quick feedback.

I will give this feedback to our layout team.

6

Hi Lucy,

I understand that we can request a quote through Custom Quote | Sierra Circuits. Should I submit the Gerber files there for your team to review and provide a quote and estimated lead time, or is there another way you would prefer?

7

You could do that but let me get you in touch with an account manager. If needed, they’ll get you in touch with our engineering team as well. I’ll email you at the address you used to register here.