The Via Thermal Resistance Calculator computes the required number of thermal vias you can include in a via arrangement connecting a thermal pad

Features of the tool:

  • Supports two types of via pattern (via pattern 1 and via pattern 2)
  • Provides a list of commonly used conductive and non-conductive epoxy via fills along with their thermal characteristics (Tg, CTE, and k)
  • Supports multiple units(mm of via dimensions and plating thickness
  • Determines the thermal resistance of via/vias by optimizing drill diameter and via-to-via spacing
  • Input units can be changed