Originally published at: https://www.protoexpress.com/blog/future-of-pcb-etching-laurent-nicolet/
Laurent Nicolet, the Vice President of Business Units Electronics at the Schmid Group, talks about the future of wet and dry PCB etching technologies and machinery in this interview. Laurent has been in the PCB industry since 1982 and has a unique perspective to share. Highlights: The dry etching method, utilizing plasma technology, is the future of PCB etching. It requires ABF with silica fillers or polyamide for base material. Vertical machines, equipped with magnetic clamps, facilitate easy transport of panels as thin as 25 microns. HDI mSAP approach achieves an impressive line spacing of just 7 microns. Watch the…