7 DFM guidelines for an efficient PCB stack-up

Design and Layout
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DFM-checks-for-PCB-Stack-up
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  1. Include all the layer details, impedance specifications and overall board thickness in your fab drawing.
  2. Ensure symmetry in your stack-up to avoid bow and twist.
  3. Opt for foil construction for HDI boards as it offers better thermal performance.
  4. Do not place signal layers adjacent to each other to avoid EMI.
  5. Have a minimum dielectric thickness of 3.5 mil with two plies of prepregs for IPC class 3 circuit boards (fab drawing).
  6. Limit the number of lamination cycles to fewer than four to avoid hole misalignment and corner cracks caused by CTE mismatch.
  7. Clearly mention the surface finish requirement in your fab drawing.