RF designs are unforgiving—and sometimes even flawless circuits fail at the fab or assembly stage. Let’s talk about how to avoid that.
In this webinar, we’ll break down the DFM and DFA practices that every RF designer should know—especially if you’re working on 5G, IoT, radar, or satellite systems.
We’ll cover the design rules that matter most:
Choosing the right materials and stack-ups
Avoiding impedance mismatches and antenna headaches
Making sure your layout can actually be assembled without surprises
And why surface finish, via structure, and spacing rules can make or break your prototype
This one’s for designers who want to get it right the first time—no re-spins, no guesswork.
Live on Zoom June 26th 10am PT
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When striving to minimize impedance discontinuities along, say, a GCPW antenna feed line, packages that we need to use for components that are part of the tuning network and/or ESD protection (https://www.ti.com/product/TPD1E0B04) need to be rather small (0402 imperial at most). What footprint would we prefer for shunt components given that signal integrity calls for eliminating stubs and thermal relief spokes on the “pad” that is on the coplanar ground side, while at the same time this results in a large thermal imbalance of the two pads and goes against DFA for preventing tombstoning?
Hi Marko,
You have asked multiple questions in same line. if you could break it down it would be easier to understand, also if you can give any image of layout that would also be helpful in understanding the question,
Nowadays the thermal relief pads are not needed for SMD components and reflow machines and they were mostly used for through hole components, also unclear how tombstoning comes into picture here.
keep the Component pads close to antenna to reduce the length, its not a stub but have that length small.
There is only one question, “what footprint would we prefer” and everything else is the necessary context. I am adding a screenshot of an example of preferred footprints for good signal integrity - no thermal relief allowed for pads, even on the ground pour side. I have circled in blue the two shunt components who’s opposite pads have drastically different thermal mass. For both components the pads on the feed line are small, but the pads on the ground side are part of the ground pour. For small capacitors this is a recipe for tombstoning.
Live on Zoom
June 26th
10am PT