Webinar: Design Considerations for Integrating Antennas into RF PCBs

Thank you for your interest in our webinar on integrating antennas in RF PCBs. It was presented by Vandana CC.

Missed the webinar? Click the link below to watch the recording.

You can ask your questions on this thread.

Question Answer
Ok, if we do not cover the antenna trace with Solder Mask, how do we protect the traces from the environment? You can choose between a gold finish or an ENIG finish. This will provide a smooth surface, which helps reduce signal loss. If you’re worried about the nickel content in ENIG, opt for a soft gold finish instead. However, it’s worth noting that the nickel content in ENIG is very low.
In our case, we use an OSP finish surface. We must use a solder mask on the antenna trace in such a case. Correct? OSP is typically used to protect the copper surface during the period between PCB fabrication and assembly. However, it’s not ideal for long-term protection as it lacks the durability like other surface finishes.
When would it be better to use stripline (with 2 vias) instead of microstrip for RF traces? In most cases, it’s best to keep the antenna and the RF trace on the same layer, which is why a microstrip is typically preferred. Using striplines requires vias, and the impedance of those vias is difficult to control accurately. At radio frequencies, such impedance discontinuities can cause signal loss and reflections, which reduce the power delivered to the antenna. This is why many antenna chip manufacturers also recommend avoiding striplines in their application notes.
Do you have a database of recommended predefined stack-ups based on the materials you tipically use? We are currently working on creating a database on our Stackup Designer library. If you need help designing stack-ups, send us an inquiry, and our experts will help you.