Originally published at: https://www.protoexpress.com/blog/sap-and-msap-pcb-manufacturing-what-designers-need-to-know/
Semi-additive process (SAP) and modified semi-additive process (mSAP) are advanced PCB manufacturing technologies that build conductive features additively rather than etching them from copper foil. These processes support finer line widths, tighter spacing, improved impedance control, and higher routing densities than conventional subtractive etching. SAP supports the finest features required for advanced packages. mSAP provides a more economical solution for high-volume applications such as smartphones and substrate-like PCBs (SLPs). Layout engineers designing ultra-high-density interconnect (UHDI), high-speed, RF, or SLP boards should understand the differences between additive technologies to choose the most suitable process for their application. In this article, you’ll…