Join our webinar on RF thermal management and simulation with Ozen Engineering.
Webinar agenda:
- Why thermal management is critical in RF circuit design
- Identifying heat sources
- Modes of heat transfer in RF systems
- Comparing thermal properties of common RF laminates
- Stack-up design for efficient heat dissipation
- Thermal pads and exposed die in high-power RF components
- The importance of heatsinks
- Thermal vias: design and placement
- DFM tips for thermal management
- Simulating trace and via layouts for more accurate PCBA thermal analysis
- Using thermal vias and trace layout to avoid heat concentration in high-power PCB assemblies
- Capturing the effect of different trace and via distributions on thermal performance
Missed the webinar? Click the link below to watch the recording.