RF Series 4/4: RF PCB Thermal Management and Simulation

Join our webinar on RF thermal management and simulation with Ozen Engineering.

Webinar agenda:

  • Why thermal management is critical in RF circuit design
  • Identifying heat sources
  • Modes of heat transfer in RF systems
  • Comparing thermal properties of common RF laminates
  • Stack-up design for efficient heat dissipation
  • Thermal pads and exposed die in high-power RF components
  • The importance of heatsinks
  • Thermal vias: design and placement
  • DFM tips for thermal management
  • Simulating trace and via layouts for more accurate PCBA thermal analysis
  • Using thermal vias and trace layout to avoid heat concentration in high-power PCB assemblies
  • Capturing the effect of different trace and via distributions on thermal performance

Click the link below to register!

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