Originally published at: https://www.protoexpress.com/blog/rf-pcb-via-design-challenges-with-layout-solutions/
When designing vias for RF PCBs, their impedance should match the desired value in the operating bandwidth. To achieve this, consider the number and placement of stitching vias, pad, and antipad sizes, and the inclusion or removal of non-functional pads. In this article, you’ll learn the challenges in designing vias for radio frequency circuits and the best layout practices to overcome them. Highlights: Minimize via diameters between 0.2 mm (8 mil) and 0.4 mm (16 mil) or smaller to reduce parasitic inductance. Maintain a minimum spacing of λ/20 between stitching vias to minimize impedance mismatches. Add a ground return via…