Originally published at: Microvia Aspect Ratio: HDI Design Mistake | Sierra Circuits
Designing a microvia with an excessive aspect ratio is one of the typical causes of reliability issues in HDI PCBs. It can result in non-uniform plating, increased mechanical stress, and cracks in plated holes. Fabricators appreciate reviewing the aspect ratio during the design phase, as it allows them to identify manufacturability risks early and recommend changes before they become expensive respins. For PCB designers, it helps in selecting the right dielectric thickness, via dimensions, and stack-up, reducing design iterations and accelerating time-to-market. In a recent webinar, how to nail your HDI PCB routing, we asked designers about their biggest challenges…