Layer stack-up consideration for two-Layer PCB

I’m working on a two-layer PCB layout for an analog audio application. The board is relatively large (around 18cm x 12cm) and uses through-hole components. The design requires a dual power supply. Given these considerations, which of the following layer assignments would be the most suitable for routing signals, power, and ground?

Options:

  1. Top layer: Ground plane and power supply tracks; Bottom layer: Signals

  2. Top layer: Signals; Bottom layer: Ground plane and power supply tracks

  3. Top layer: Ground plane; Bottom layer: Signals and power supply tracks

  4. Top layer: Signals and power supply tracks; Bottom layer: Ground plane

I’m looking for insights on the best practice for separating analog signals, power, and ground in a dual-supply audio circuit, considering factors like noise coupling, return paths, and ease of routing. Your advice will help me make an informed decision on the layer stack-up for this design.

1 Like

Why does it matter?

I think the general rule is that it is better to route (break up into traces, rather than having a full plane) power than ground, so that would suggest 3 or 4, but … If you ever need to cross tracks over each other, you’ll have to either use a “0-ohm resistor” or other wire … or send stuff to the “wrong” side.

With through-hole devices, you’re not even breaking one side up more than the other.

Maybe some components would be happier with their body by a ground plane? Maybe the ground plane on the other side will provide some shielding?

If you experiment and it turns out to matter, please do report back.

I believe through-hole designs and 2-layer boards are perfectly valid options in many situations.

For most cases, I recommend using a ground plane and a signal/power plane. This approach is well-established and reliable, and there’s no strong reason to avoid it. The placement of the signals on either side isn’t critically important.

You might need to create some jumpers in the ground plane, but this shouldn’t pose any issues as long as you avoid making large cuts.

1 Like

Dividing spaces into power, ground, and signals often leads to complications because such partitioning is neither necessary nor sufficient for a good result.

For complex boards—such as those with mixed analog/digital signals, high-speed signals, high currents, or SMPS—a full ground plane can be beneficial. However, it’s crucial to understand where the return currents are flowing, as even with a ground plane, it’s easy to make mistakes.

I suggest using the Manhattan layout with a gridded ground. The key advantage of the Manhattan layout is that it allows you to always find a route for your track. You don’t have to take a meandering route away from the return path or cut through a ground plane, which compromises its integrity.

Manhattan routing dedicates one layer for North-South connections and the other for East-West connections. This approach ensures you can always get from point A to point B with typically one via and avoids crossing tracks.

To start, create a gridded ground. On one layer, place a track every 20mm in columns. On the other layer, do the same in rows and connect them with vias at every intersection. This provides a ground almost as good as a plane while keeping both layers available for routing power and signals. Adjust the ground tracks to accommodate your ICs, but keep them close together.

Regarding the ground plane versus gridded ground, I’ve found that junior engineers often rely too heavily on the ground plane, thinking it will handle all isolation issues. This can lead to poor design decisions, such as running high currents past sensitive inputs.

To help them understand return currents better, I sometimes remove the ground plane and force them to consider return currents as discrete flows in separate tracks. Once the layout is fixed, the ground plane can be restored.

On a 4-layer board, dedicating one layer to a solid ground is feasible. On a 2-layer board, routing space is limited, making the Manhattan layout particularly useful. If you dedicate one layer to ground, even a simple layout can result in tracks cutting through the ground, compromising its integrity.

A gridded ground is a flexible alternative. You can increase the number of ground tracks where needed, and it works well with Manhattan routing. After completing the layout, you can flood it with ground copper, resulting in a better-routed board because you’ve considered all return currents.

Good PCB design is both an art and a science. Designing without a ground plane helps engineers develop an intuition for current flow, speeding up the learning process.

1 Like

Given that all components are through-hole, it would be wise to use a ground plane on the bottom. This ensures that components can be mounted without worrying about their bodies making contact with the ground copper.
However, why limit yourself to just two layers? Consider using a 4-layer board to get the signal tracks off the top layer entirely. The cost increase is minimal, and the added peace of mind is well worth it.

1 Like

For optimal audio PCB design, consider using SMD components. This approach offers several advantages:

  1. Expanded component selection: SMD parts come in a wider variety, giving you more options for your design.
  2. Cost-efficiency: SMD components are generally less expensive than through-hole alternatives.
  3. Easier assembly: Soldering SMD parts is typically faster and more straightforward, reducing production time and complexity.
  4. Enhanced routing flexibility: The compact nature of SMD components allows for more efficient PCB layout and routing.

For a two-layer board, place SMD parts on the top layer. Use this layer for most interconnections, reserving the bottom layer as a ground plane. On the bottom layer, use it only for short ‘jumpers’ to other signals. Ensure these jumpers are spaced apart to allow ground currents to flow freely around each one individually. The objective is to minimize the maximum dimension of any hole in the ground plane, rather than reducing the quantity of holes.

Create solid ground connections using separate vias positioned close to each pin needing a ground connection. This approach enhances grounding integrity and minimizes interference with other trace routing. Remember to carefully plan the routing of signal traces, especially in audio applications where maintaining a high signal-to-noise ratio is critical. Avoid routing amplified output traces near sensitive input traces to prevent noise interference.

1 Like