Thermal management is particularly important during soldering. Large copper pours or planes connected to component pads can act as heat sinks, creating uneven heating across a component. This can contribute to soldering defects such as incomplete wetting or uneven solder distribution.
It is worth reviewing thermal connections, pad geometry, and stencil design together rather than treating them as separate checks.
For a deeper look at solderability, soldering defects, flux, thermal considerations, and the factors that affect solder joint reliability, check out our article: How to Achieve Perfect PCB Soldering.