Components soldering issue (Fillet issue)

Assembly and Components
1

Hi Team,

I am facing some issue related assembly issue for PTH components. In general, Thermal spokes will be used for most of power design. due to tight component placement, to achieve the current capacity, provided filled copper for PTH for all places. Assembly team not able do 100% fillet for PTH components. Assembly team suggested to use Thermal spokes for PTH. is any suggestion.

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2

To meet current requirements while improving solder joint quality, adding thermal reliefs to PTH pads, if possible, it can significantly reduce heat dissipation during wave or selective soldering. It’ll allow for more consistent solder flow and improved wetting which is especially important for Class 3 PCBAs. if thermal reliefs are not viable due to high-current demands, you can consider this to improve the solder fillet.

  • Use cleaning flux, as its stronger activation improves solder wetting and joint quality, especially on oxidized or challenging surfaces.

  • Utilize the wave soldering process for better solder coverage and consistency.

  • Optimize the preheat profile and dwell time during soldering to ensure proper solder flow and thermal balance.

  • Review and adjust the barrel hole size to support full solder fillet formation and improve mechanical integrity.

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