Thanks to everyone who joined our forum and got a copy of Bogatin’s Practical Guide to Transmission Line Design and Characterization for Signal Integrity Applications.
This thread is for you to ask your questions related to the ebook. Or just share your thoughts!
The example of routing diff pairs on the top and bottom layers for a 4-layer board is very common. I recommend the 2 gnd layers,l then you can use shorting vias directly. They have about 1/2 the inductance as the two DC-blocking capacitors.
Hi Lucy, I am Raul. I am a Staff HW Engineer who does both RF and Digital designs. My interests is continuing to broaden my technical acumen. Always trying to learn and grow my experiences in multiple engineering disciplines. I look forward to the opportunity in learning more from “Bogatin’s Practical Guide to Transmission Line Design and Characterization for Signal Integrity Applications”.
Just registered. I design/use burn-in boards for accelerated life tests conducted on high power CPU/GPU products that exhibit large current swings when running test patterns at relatively low speeds. I’m interested in limiting voltage over/undershoots while modulating stress voltages to keep the time average power within the burn-in hardware’s cooling capabilities. I look forward to reading Dr. Bogatin’s book.