How do we calculate how much weight an SMD pad can hold on a PCB? Are there methods to identify these parameters?
Absolutely, Michael! It’s a common concern. Key factors include pad size, material properties (like FR-4), solder joint quality, and more. Thicker PCBs generally handle more weight. Testing and simulations help too. Anyone else have tips?
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Totally agree with your points. In my experience, thorough testing under real-world conditions is crucial. Also, industry standards can provide valuable guidelines. Simulations, like Finite Element Analysis (FEA), can predict how the PCB handles stress.
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I’m not aware of a precise method to calculate that specific value, but I suggest examining the peel strength. The problem often stems from the bond quality between the copper and the underlying substrate. We’re primarily concerned with how well the copper adheres to the substrate rather than focusing solely on solder adherence, so it’s a good idea to begin by assessing peel strength.
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