Webinar: Designing for Signal and Power Integrity Using Thin Laminates

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1

Thanks for your interest in our webinar with Oak-Mitsui Technology’s FaradFlex™.

Webinar agenda:

  • Where designers commonly go wrong with DFM

  • How to design for manufacturing

    • Picking materials and planning your stack-ups

    • Optimizing trace width and space

    • Designing vias and via-in-pads

    • Implementing solder mask and silkscreen

  • What the manufacturer needs from you

  • FaradFlex key material characteristics

  • Impedance of embedded capacitors

  • Near-field EMI ground via stitching

  • Signal integrity of power/ground return

Missed the webinar? Click the link below to watch the recording.

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Thanks Steve for creating this event while I was at the dentist. :slight_smile:

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Sounds great, please add the missing link for registering, thank you!

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Oops… forgot to share it with Steve. Added. Thx Marko!