Originally published at: https://www.protoexpress.com/blog/why-high-power-pcbs-fail/
High-power PCBs fail when current-induced heating, voltage stress, and mechanical strain exceed the design limits. These problems are often caused by poor design decisions, including layout planning, stack-up, and thermal management. This can lead to overheating and long-term structural damage. Board designers and power electronics engineers should optimize thermal paths, maintain adequate creepage and clearance, balance copper distribution, and validate designs under real operating conditions to avoid board failures. In this article, you will learn the 3 common causes of high-power PCB failure and the design techniques to prevent thermal, electrical, and mechanical issues. Highlights: Design high-current traces using IPC-2152…