Originally published at: https://www.protoexpress.com/blog/case-study-implementing-loose-leaf-rigid-flex-pcb-stackup-for-enhanced-flexibility/
When designing a flex circuit board, balancing structural reliability and signal integrity is paramount. In our recent project, we tackled this challenge with an innovative loose-leaf rigid-flex stack-up. The design’s overall thickness ranges between 10 to 20 mil with a bend radius of 2 inches. Additionally, it must accommodate 253 controlled impedance traces between two connectors. In this case study, you will learn how our flex PCB design engineers achieved the desired specs using a loose-leaf rigid-flex build-up. Highlights: To achieve the desired flex thickness and bending radius, we transformed a flex design into a loose-leaf rigid-flex stack-up. To prevent…
1 Like