# \#in-circuit-testing

**URL:** https://sierraconnect.protoexpress.com/tag/in-circuit-testing/87.md

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## [Ask Me Anything about In-Circuit Testing & Flying Probe Testing](https://sierraconnect.protoexpress.com/t/ask-me-anything-about-in-circuit-testing-flying-probe-testing/3151)

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**Author:** [@lucy.sierracircuits](https://sierraconnect.protoexpress.com/u/lucy.sierracircuits)\
**Replies:** 8\
**Last updated:** [May 14, 2025, 12:11am UTC](https://sierraconnect.protoexpress.com/t/ask-me-anything-about-in-circuit-testing-flying-probe-testing/3151 "2025-05-14T00:11:55Z")

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Join our next Ask Me Anything about ICT and flying probe testing where you can ask us questions on: Test methods Board size and complexity Test points And much more! Post questions before: May 14th Please, note that…

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## [TIP: ICT test point under a BGA component](https://sierraconnect.protoexpress.com/t/tip-ict-test-point-under-a-bga-component/422)

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**Author:** [@lucy.sierracircuits](https://sierraconnect.protoexpress.com/u/lucy.sierracircuits)\
**Replies:** 0\
**Last updated:** [November 13, 2023, 4:52pm UTC](https://sierraconnect.protoexpress.com/t/tip-ict-test-point-under-a-bga-component/422 "2023-11-13T16:52:26Z")

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With a significant amount of pressure, exerted by the nails under BGAs, there is a high risk of breaking the solder joints, Hence, it is crucial to avoid placing a test point under a BGA component. At least, leave a 5.08…