# Seminar: PCB, Enclosure and Cabling Design to Control EMI by Rick Hartley

**URL:** <https://sierraconnect.protoexpress.com/t/seminar-pcb-enclosure-and-cabling-design-to-control-emi-by-rick-hartley/699>\
**Category:** Webinars & Events\
**Tags:** emi, rick-hartley\
**Created:** [December 13, 2023, 5:11pm UTC](https://sierraconnect.protoexpress.com/t/seminar-pcb-enclosure-and-cabling-design-to-control-emi-by-rick-hartley/699 "2023-12-13T17:11:16Z")\
**Posts on this page:** 1\
**Page:** 1

<div class="post-metadata">

**Author:** ![lucy.sierracircuits](https://sea2.discourse-cdn.com/sierraconnect/user_avatar/sierraconnect.protoexpress.com/lucy.sierracircuits/32/8_2.png) [@lucy.sierracircuits](https://sierraconnect.protoexpress.com/u/lucy.sierracircuits)\
**Post date:** [December 13, 2023, 5:11pm UTC](https://sierraconnect.protoexpress.com/t/seminar-pcb-enclosure-and-cabling-design-to-control-emi-by-rick-hartley/699/1 "2023-12-13T17:11:16Z")

</div>

> **PCB, Enclosure and Cabling Design to Control EMI by Rick Hartley**
>
> **Starts:** March 14, 2024, 8:30am (America/Los\_Angeles)\
> **Ends:** March 15, 2024, 5:00pm (America/Los\_Angeles)\
> **Link:** <https://www.protoexpress.com/event/pcb-enclosure-and-cabling-design-to-control-emi-by-rick-hartley/?utm_source=sierraconnect&utm_medium=display&utm_campaign=hartley%2Bemi%2Bseminar%2Bthread%2Bdec%2B2023>

**Date and time:**

March 14th and 15th, 2024

From 8:30 AM to 5:00 PM Pacific time

**Location:** This event will be hosted online via Zoom

**Early bird price through January 31st, 2024: $495** (then $595)

Items discussed are:

- Energy movement in PC boards and how to control it
- Driving factors behind frequency in digital and analog circuits
- Common grounding problems that lead to EMI
- Improper use of planes in a printed circuit board
- Proper design and termination of transmission lines
- Routing techniques that cause EMI and how to avoid them
- Why some commonly used PCB design techniques cause EMI
- Component placement to prevent EMI
- Cross talk in single-ended lines and differential lines
- Proper setup and routing of differential Pairs
- Impact of IC package design on EMI
- Problems caused by poor connector pin assignment
- Problems caused by improper I/O connector location
- PDN design and decoupling for low, medium and high-layer PCBs
- Proper PCB layout of switch mode power supplies
- Ground planes- to split or NOT to split… that is the question
- Board stack-ups that cause EMI and those that resolve noise and EMI
- Problems with LCD displays
- Setup of the I/O structure to prevent EMI
- Proper shielding of I/O cables
- Proper chassis design to prevent EMI
