# RF Series 4/4: RF PCB Thermal Management and Simulation **URL:** \ **Category:** Webinars & Events\ **Tags:** rf\ **Created:** [September 24, 2025, 5:23pm UTC](https://sierraconnect.protoexpress.com/t/rf-series-4-4-rf-pcb-thermal-management-and-simulation/3591 "2025-09-24T17:23:34Z")\ **Posts on this page:** 1\ **Page:** 1
**Author:** ![lucy.sierracircuits](https://sea2.discourse-cdn.com/sierraconnect/user_avatar/sierraconnect.protoexpress.com/lucy.sierracircuits/32/8_2.png) [@lucy.sierracircuits](https://sierraconnect.protoexpress.com/u/lucy.sierracircuits)\ **Post date:** [September 24, 2025, 5:23pm UTC](https://sierraconnect.protoexpress.com/t/rf-series-4-4-rf-pcb-thermal-management-and-simulation/3591/1 "2025-09-24T17:23:34Z")
Join our webinar on RF thermal management and simulation with Ozen Engineering. **Webinar agenda:** - Why thermal management is critical in RF circuit design - Identifying heat sources - Modes of heat transfer in RF systems - Comparing thermal properties of common RF laminates - Stack-up design for efficient heat dissipation - Thermal pads and exposed die in high-power RF components - The importance of heatsinks - Thermal vias: design and placement - DFM tips for thermal management - Simulating trace and via layouts for more accurate PCBA thermal analysis - Using thermal vias and trace layout to avoid heat concentration in high-power PCB assemblies - Capturing the effect of different trace and via distributions on thermal performance **Missed the webinar?** Click the link below to watch the recording. > **RF PCB Thermal Management and Simulation** > > **Starts:** October 23, 2025, 10:00am (America/Los\_Angeles)\ > **Ends:** October 23, 2025, 11:00am (America/Los\_Angeles)\ > **Location:** https://www.protoexpress.com/webinars/rf-pcb-thermal-management-and-simulation/?utm\_source=sierraconnect&utm\_medium=display&utm\_campaign=ozen%2Brf%2Bthermal%2Bwebinar%2Bthread%2Boct%2B2025