# De-Panelization Methods for Thick PCBs
**URL:** https://sierraconnect.protoexpress.com/t/de-panelization-methods-for-thick-pcbs/1075
**Category:** Manufacturing process
**Created:** [February 13, 2024, 4:23pm UTC](https://sierraconnect.protoexpress.com/t/de-panelization-methods-for-thick-pcbs/1075 "2024-02-13T16:23:45Z")
**Posts on this page:** 3
**Page:** 1
### Author:  [@Lieniner](https://sierraconnect.protoexpress.com/u/Lieniner)
#### Post date: [February 13, 2024, 4:23pm UTC](https://sierraconnect.protoexpress.com/t/de-panelization-methods-for-thick-pcbs/1075/1 "2024-02-13T16:23:45Z")
We’re working with a board that’s quite thick at .125 inches and are considering the best method for de-panelization. I’ve considered mouse bites, but even those seem challenging to use, given the thickness. Any suggestions or alternatives?
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### Author:  [@steve.carney](https://sierraconnect.protoexpress.com/u/steve.carney)
#### Post date: [February 14, 2024, 9:46pm UTC](https://sierraconnect.protoexpress.com/t/de-panelization-methods-for-thick-pcbs/1075/2 "2024-02-14T21:46:18Z")
First choice would be routing. We have special machines for routing out populated boards after assembly. Next is “V” scoring – score to break - which works OK but edges can be rough. Also has to be done prior to assembly. Mouse bites won’t work due to the panel thickness.
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### Author:  [@BerndKruger](https://sierraconnect.protoexpress.com/u/BerndKruger)
#### Post date: [April 16, 2024, 3:41pm UTC](https://sierraconnect.protoexpress.com/t/de-panelization-methods-for-thick-pcbs/1075/3 "2024-04-16T15:41:07Z")
You might consider requesting partial milling at the tabs if your current setup allows for depaneling 62-mil panels.