# Aspect ratio of through hole via

**URL:** <https://sierraconnect.protoexpress.com/t/aspect-ratio-of-through-hole-via/657>\
**Category:** Design for Manufacturing\
**Created:** [December 3, 2023, 9:32am UTC](https://sierraconnect.protoexpress.com/t/aspect-ratio-of-through-hole-via/657 "2023-12-03T09:32:04Z")\
**Posts on this page:** 9\
**Page:** 1

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**Author:** ![Sajal\_ee](https://avatars.discourse-cdn.com/v4/letter/s/d26b3c/32.png) [@Sajal\_ee](https://sierraconnect.protoexpress.com/u/Sajal_ee)\
**Post date:** [December 3, 2023, 9:32am UTC](https://sierraconnect.protoexpress.com/t/aspect-ratio-of-through-hole-via/657/1 "2023-12-03T09:32:05Z")

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I read that aspect ratio of TH plating via is between 10:1 to 6:1

I was trying to calculate the dielectric height and via pad diameter for these aspect ratios

If the via pad is 6 mil and the dielectric height is 60 mil then the aspect ratio of the via is 10:1, right ?

If the via pad is 10 mil and the dielectric height is 60 mil then the aspect ratio of the via is 6:1, right ?

It look like that manufacturing 10:1 via is more expansive and difficult then 6:1 via, is that correct ?

If yes then 4:1 via is further more easier to manufacture or have bigger via pad compared to 6:1 via. The via pad size will be then 15 mil in 4:1 via if the dielectric height is 60 mil.

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**Author:** ![atar.mittal](https://sea2.discourse-cdn.com/sierraconnect/user_avatar/sierraconnect.protoexpress.com/atar.mittal/32/49_2.png) [@atar.mittal](https://sierraconnect.protoexpress.com/u/atar.mittal)\
**Post date:** [December 4, 2023, 7:25pm UTC](https://sierraconnect.protoexpress.com/t/aspect-ratio-of-through-hole-via/657/2 "2023-12-04T19:25:11Z")

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> [@Sajal\_ee](#):
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> If the via pad is 6 mil and the dielectric height is 60 mil then the aspect ratio of the via is 10:1, right ?

The via pad has nothing to do with the aspect ratio. It’s the hole size.

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**Author:** ![atar.mittal](https://sea2.discourse-cdn.com/sierraconnect/user_avatar/sierraconnect.protoexpress.com/atar.mittal/32/49_2.png) [@atar.mittal](https://sierraconnect.protoexpress.com/u/atar.mittal)\
**Post date:** [December 4, 2023, 7:25pm UTC](https://sierraconnect.protoexpress.com/t/aspect-ratio-of-through-hole-via/657/3 "2023-12-04T19:25:36Z")

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> [@Sajal\_ee](#):
>
> If the via pad is 10 mil and the dielectric height is 60 mil then the aspect ratio of the via is 6:1, right ?

Again, that’s the hole size.

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**Author:** ![steve.carney](https://sea2.discourse-cdn.com/sierraconnect/user_avatar/sierraconnect.protoexpress.com/steve.carney/32/50_2.png) [@steve.carney](https://sierraconnect.protoexpress.com/u/steve.carney)\
**Post date:** [December 4, 2023, 7:45pm UTC](https://sierraconnect.protoexpress.com/t/aspect-ratio-of-through-hole-via/657/4 "2023-12-04T19:45:12Z")

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> [@Sajal\_ee](#):
>
> It look like that manufacturing 10:1 via is more expansive and difficult then 6:1 via, is that correct ?

It doesn’t work like this. 10:1 and 6:1 vias are through-holes. What impacts the cost of manufacturing is having smaller holes or blind/buried vias because they take more time to fabricate. Below 6 mils, your fab house will probably use laser drilling, which is more expensive.

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**Author:** ![steve.carney](https://sea2.discourse-cdn.com/sierraconnect/user_avatar/sierraconnect.protoexpress.com/steve.carney/32/50_2.png) [@steve.carney](https://sierraconnect.protoexpress.com/u/steve.carney)\
**Post date:** [December 4, 2023, 8:49pm UTC](https://sierraconnect.protoexpress.com/t/aspect-ratio-of-through-hole-via/657/5 "2023-12-04T20:49:59Z")

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This is a video of our mechanical drilling.  
https://fast.wistia.net/embed/iframe/c59msdym0c

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<div class="post-metadata">

**Author:** ![Sajal\_ee](https://avatars.discourse-cdn.com/v4/letter/s/d26b3c/32.png) [@Sajal\_ee](https://sierraconnect.protoexpress.com/u/Sajal_ee)\
**Post date:** [December 5, 2023, 8:47am UTC](https://sierraconnect.protoexpress.com/t/aspect-ratio-of-through-hole-via/657/6 "2023-12-05T08:47:25Z")

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Is that true 10:1 has smaller via hole compared to 6:1 ?

If yes than manufacturing 10:1 via is more expansive and difficult then 6:1 via, correct ?

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**Author:** ![steve.carney](https://sea2.discourse-cdn.com/sierraconnect/user_avatar/sierraconnect.protoexpress.com/steve.carney/32/50_2.png) [@steve.carney](https://sierraconnect.protoexpress.com/u/steve.carney)\
**Post date:** [December 5, 2023, 4:32pm UTC](https://sierraconnect.protoexpress.com/t/aspect-ratio-of-through-hole-via/657/7 "2023-12-05T16:32:27Z")

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Like I said, 10:1 and 6:1 are aspect ratios, not via sizes. That doesn’t impact the cost of manufacturing.

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**Author:** ![steve.carney](https://sea2.discourse-cdn.com/sierraconnect/user_avatar/sierraconnect.protoexpress.com/steve.carney/32/50_2.png) [@steve.carney](https://sierraconnect.protoexpress.com/u/steve.carney)\
**Post date:** [December 6, 2023, 4:33pm UTC](https://sierraconnect.protoexpress.com/t/aspect-ratio-of-through-hole-via/657/8 "2023-12-06T16:33:36Z")

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Just for reference, this is how we laser drill.

https://fast.wistia.net/embed/iframe/8fx3bqaayh

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<div class="post-metadata">

**Author:** ![Sajal\_ee](https://avatars.discourse-cdn.com/v4/letter/s/d26b3c/32.png) [@Sajal\_ee](https://sierraconnect.protoexpress.com/u/Sajal_ee)\
**Post date:** [December 6, 2023, 5:48pm UTC](https://sierraconnect.protoexpress.com/t/aspect-ratio-of-through-hole-via/657/9 "2023-12-06T17:48:40Z")

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Thanks. I have watched the videos.
